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SEMI, UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States
February 6, 2024 | SEMIEstimated reading time: 1 minute
SEMI announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain. Offered by SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) and funded by the National Institute of Standards and Technology (NIST), the Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP) highlights critical areas of development needed to establish advanced packaging facilities on U.S. soil.
Based on the Heterogeneous Integration Roadmap (HIR), the guide incorporates a manufacturing approach to implement the HIR. Some 100 chip industry veterans from more than 40 companies collaborated with representatives from academic institutions, industrial consortia, and government agencies to develop the guide.
Addressing hardware and software tools, manufacturing processes, and supplier infrastructure, the guide covers tools, processes, standards, and interdependencies that enable advanced packaging for high-performance computing (HPC), medical, health and wearables applications.
“The MRHIEP drills down into operational objectives by examining current capabilities and highlighting critical areas of development needed for onshored manufacturing to be successful in the U.S.,” said Melissa Grupen-Shemansky, SEMI CTO. “The guide provides vital support for implementation of the HIR, a comprehensive document addressing the global supply chain for heterogenous integration.”
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SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
05/15/2024 | SEMISEMICON West 2024 will gather industry experts and leaders July 11-13 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.
Using AI to Redefine Productivity
05/15/2024 | Nolan Johnson, SMT007 MagazinePlato Systems, a machine perception company spun out of Stanford University, employs AI and video data to analyze and optimize the human component in manufacturing. Initially focused on semiconductors, Plato Systems has expanded into EMS manufacturing. Co-founder and CEO Amin Arbabian, along with product advisor Anders Holden and head of growth Luis Vidal, discuss their approach to changeover optimization and its impact on productivity in the industry. They’ve also included customer Raj Vora in the conversation.
SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
05/15/2024 | BUSINESS WIRESMTC Corporation, a leading North American provider of electronics manufacturing services, is pleased to announce the appointment of Mike Buseman as President & Chief Executive Officer, effective May 13, 2024.
ACDi Expands East Coast Presence with Acquisition of Fourth Manufacturing Plant
05/13/2024 | ACDiACDi, a leading provider of electronics manufacturing services, today announces the expansion of its East Coast presence and manufacturing capabilities with the acquisition of a fourth manufacturing plant in Kilmarnock, Virginia. The company signed an asset purchase agreement with QinetiQ to acquire their Virginia facility and its assets, including SMT, wave soldering, AOI and SPI equipment. The deal brings ACDi to 4 East Coast locations with a total of 9 SMT lines.
LPKF is Ready for Increasing Demand for Glass Substrates in the Semiconductor Industry
05/13/2024 | LPKFThe semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this new era from ramp-up to high volume manufacturing.