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Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
Level Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
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IPC’s Advanced PCB Design Concepts Training Course
January 19, 2024 | IPCEstimated reading time: Less than a minute
The Advanced PCB Design Concepts course, 6:30 to 8:30 p.m. EDT March 18 to May 15, 2024, with virtual classes held on Mondays and Wednesdays, will start with the design of HDI and advanced packaging concepts. This will be followed by embedded component design and the students will see how concepts from HDI are used in the implementation of embedded components. Next, concepts necessary for the design of wearable electronics and how the use of concepts from HDI and Embedded are necessary to achieve the small size and light weight of wearable electronics.
The course covers the skills necessary to create IPC-compliant PCB designs with:
- Advanced or complex packaging
- Reduced available board area
- Non-orthogonal placement and routing
- Non-standard board outline geometry
- Non-standard board mounting
- Advanced board materials
- Embedded components
- Cavities to reduce the overall volume/skyline of the design
- Human interface/wearable technology
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Peters: Casting Compound Perfectly Protects Electronics from Overheating
05/15/2024 | PetersWith ELPECAST® VU 4545/101, Peters has recently added a casting compound to its product portfolio that is characterised by particularly high thermal conductivity.
Avnet to Exhibit at the 2024 Embedded Vision Summit
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Kitron: Completed Share Buyback in Connection with Remuneration to the Board Members
05/14/2024 | KitronKitron ASA has completed share buyback in connection with remuneration to the board members. Reference is made to the stock exchange release by Kitron ASA published on 13. May 2024 regarding initiation of a share buyback program.
Real Time with… IPC APEX EXPO 2024: Digitization and Regular Updates of the iNEMI Industry Roadmap
05/14/2024 | Real Time with...IPC APEX EXPORanjan Chatterjee is a board member at iNEMI. In this conversation with Editor Nolan Johnson, Chatterjee discusses the digitization of, and regular updates to, the industry roadmap. The roadmap is a collaborative effort on technologies and standards which is intended to guide CEOs and CTOs in their long-range planning. Ranjan discusses the board's role in shaping the roadmap and the vision for more frequent updates.