Low-profile Hybrid FPC-to-Board Connector from Hirose Supports 5A in Miniature Footprint
August 11, 2022 | Hirose Electric Co.Estimated reading time: Less than a minute
Hirose has developed a low-profile hybrid FPC-to-board connector with a rated current of 5A power and 0.3A signal in a miniature footprint. With a 0.3 mm pitch, 0.6 mm stacking height and 1.9 mm width, the space-saving BM57 Series connector is well-suited for a wide range of consumer and portable electronic devices.
A fully armored design that covers both ends of the housing with metal for enhanced robustness and a significant reduction in the risk of housing damage from misalignment when mating. A wide self-alignment range of ±0.22 mm in the pitch direction and ±0.3 mm in the width direction, along with guidance ribs provides smooth mating operation.
Offering enhanced PCB peeling strength, the rugged BM57 Series features three solder retention tabs at each power contact. An insert molded header and receptacle prevents solder wicking into the contact area.
“Hirose has expanded its hybrid FPC-to-board connector offering to meet the demand for smaller, thinner connectors that simplify designs and enable size reduction of consumer and other portable products,” said Mark Kojak, Chief Marketing Officer and Senior Vice President of Sales and Operations for Hirose Electric USA.
The BM57 FPC-to-board connector is commonly used in smartphones, laptops, tablets, gaming consoles and wearable devices.
Suggested Items
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.