-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
That’s Hot: Ventec’s Goodwin on Thermal Management
January 3, 2018 | Patty Goldman, I-Connect007Estimated reading time: 2 minutes
IPC’s fall committee meetings were held in conjunction with SMTA International, as has been the case for several years now. I sat in on some subcommittee meetings, including one on laminates, where I met up with Ventec COO Mark Goodwin for a discussion on thermal management from a laminate supplier’s perspective.
Patty Goldman: Good to see you, Mark. How about we talk about thermal management?
Mark Goodwin: Yes, let’s. From our perspective, there are really two material sets that we consider for thermal management. There's the IMS (insulated metal substrate) materials, the metal-back materials, which started off as an LED lighting story. But it's much, much more than an LED lighting story now, particularly with the development in e-vehicles and hybrid vehicles. There's a lot of e-powertrain, so heavy current moving power around in cars.
The second strand is a new direction for us and the technology is a thermally conductive thin core material, thermally conductive prepreg for building multilayers with thermal conductivity or using those layers and those prepregs in standard multilayer constructions, but as a hybrid, so only putting the thermal management where you need to put it.
Goldman: So, is it sort of somehow self-cooling, then?
Goodwin: The materials have a thermal capacity. They can take heat away from embedded components. For example, people using coin technology (embedding a metal inside the PCB under the high-power components so that heat can be dissipated) may not need to use that, or maybe they can use it in conjunction with thermally conductive prepregs, thermally conductive cores. As a company, we’re publishing an eBook through I-Connect007 on thermal management and the materials for thermal management. It's predominantly an IMS story, but there is some discussion in there about the new materials, thin cores and prepregs, and our thinking about thermal management. So that's thermal resistance and thermal impedance compared with thermal conductivity. There's a lot of confusion, particularly at the design stage, I believe.
Goldman: Thermal management seems to encompass a rather broad area. You must separate the parts.
Goodwin: When we talk about thermal management, we're talking about getting the heat out of components, be that an LED chip, or be that an embedded ‘whatever’ in a multilayer circuit board.
Goldman: Does this facilitate embedding?
Goodwin: Yes, the new materials do.
To read this entire article, which ran in the December 2017 issue of The PCB Design Magazine, click here.
Suggested Items
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
Real Time with... IPC APEX EXPO 2024: A Conversation with IPC's CEO: New Venue, Sustainability, and More
04/23/2024 | Real Time with...IPC APEX EXPOBarry Matties hosts Dr. John W. Mitchell, CEO of IPC, on the final day of IPC APEX EXPO 2024. They discuss the new venue in Anaheim and broach a range of topics, from traffic and booth experiences to workforce development, sustainability, and the CHIPS Act. And they offer advice for newcomers as IPC looks forward to an even better show experience next year.
Boeing's Janene Stinson Earns IPC Excellence in Education Award at IPC APEX EXPO 2024
04/22/2024 | IPCThe IPC Excellence in Education award was presented to Janene Stinson, Boeing, at IPC APEX EXPO 2024 in Anaheim, California, in recognition of her significant contributions to workforce development and leadership.
What’s Next Becomes Now at IPC APEX EXPO 2024
04/22/2024 | IPCFrom revolutionary advancements in artificial intelligence, augmented reality and the latest innovations in capital equipment on the show floor to a heightened learner experience through the 16th Electronic Circuits World Convention (ECWC16) technical conference, IPC APEX EXPO 2024 provided education, professional development and numerous networking opportunities, for 3,723 attendees from 57 countries.
Real Time with... IPC APEX EXPO 2024: Looking Back, Looking Forward With IEC
04/19/2024 | Real Time with...IPC APEX EXPOIEC came to the RTW booth and discussed both the legacy of IEC's past and the vision for its future. Industry veteran Bruno Ferri highlighted his quarter-century tenure in the industry and with IEC since its founding. He still exhibits boundless enthusiasm for the industry. Brando Stone, a young professional and a future face of IEC, talked about IEC's plans going forward and his experience at this year's IPC APEX EXPO.