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Estimated reading time: Less than a minute
EMS Discovers Mature IC Technologies
- Wire bonding;
- Ribbon bonding;
- Die bonding;
- Extraordinarily fine-pitch 0.25-mm pitch BGAs;
- Buried resistance/buried capacitance; and
- Chip on board or CoB.
Editor's Note: This column originally appeared in the December 2013 issue of SMT Magazine.
More Columns from Zulki's PCB Nuggets
Zulki's PCB Nuggets: Cleanliness is Next to ReliabilityZulki’s PCB Nuggets: Thermal Compression Bonding for Extra Fine Pitch Flip Chips
Zulki’s PCB Nuggets: WBAN Steps Into PCB Microelectronics Assembly
Zulki’s PCB Nuggets: Photonics Comes to PCB Microelectronics Assembly
Zulki’s PCB Nuggets: Sub-Micron Die Bonding—Don’t Be Misled by Five Micron Placement Standard
Zulki’s PCB Nuggets: Meet the New Player in PCB Microelectronics Assembly—Interposers
Zulki’s PCB Nuggets: How Effective Is Your PCB Microelectronics Assembly?
Zulki’s PCB Nuggets: Five Key Benefits for Onshoring PCB Microelectronics Assembly