Global Sourcing Spotlight: Golf, Friedman, and the Benefits of Global Sourcing
Nolan’s Notes: Coming to Terms With AI
The Knowledge Base: A CM’s Perspective on Box Build Practices2024 HBM Supply Bit Growth Estimated to Reach 260%, Making Up 14% of DRAM Industry
March 18, 2024 | TrendForceEstimated reading time: 1 minute
TrendForce reports that significant capital investments have occurred in the memory sector due to the high ASP and profitability of HBM. Senior Vice President Avril Wu notes that by the end of 2024, the DRAM industry is expected to allocate approximately 250K/m (14%) of total capacity to producing HBM TSV, with an estimated annual supply bit growth of around 260%. Additionally, HBM’s revenue share within the DRAM industry—around 8.4% in 2023—is projected to increase to 20.1% by the end of 2024.
HBM supply tightens with order volumes rising continuously into 2024
Wu explains that in terms of production differences between HBM and DDR5, the die size of HBM is generally 35–45% larger than DDR5 of the same process and capacity (for example, 24Gb compared to 24Gb). The yield rate (including TSV packaging) for HBM is approximately 20–30% lower than that of DDR5, and the production cycle (including TSV) is 1.5 to 2 months longer than DDR5.
Buyers eager for sufficient supply will need to lock in their orders earlier thanks to HBM’s longer production cycle of over two quarters from wafer start to final packaging. TrendForce has learned that most orders for 2024 have already been submitted to suppliers and are non-cancellable unless there are failures in validation.
Samsung and SK hynix have the most aggressive HBM production plans by the end of this year. Samsung’s total HBM capacity is expected to reach around 130K (including TSV) by year-end; SK hynix is around 120K, though capacity may vary based on validation progress and customer orders. Regarding market share for current mainstream HBM3 products, SK hynix holds over 90% of the HBM3 market, while Samsung is expected to closely follow with the gradual release of AMD’s MI300 over the next few quarters.
Share on:
Suggested Items
SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea
05/14/2024 | BUSINESS WIRESiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.
HBM Prices to Increase by 5–10% in 2025, Accounting for Over 30% of Total DRAM Value
05/06/2024 | TrendForceAvril Wu, TrendForce Senior Research Vice President, reports that the HBM market is poised for robust growth, driven by significant pricing premiums and increased capacity needs for AI chips.
Demand for NVIDIA’s Blackwell Platform Expected to Boost TSMC’s CoWoS Total Capacity by Over 150% in 2024
04/16/2024 | TrendForceNVIDIA’s next-gen Blackwell platform, which includes B-series GPUs and integrates NVIDIA’s own Grace Arm CPU in models such as the GB200, represents a significant development.
Camtek Receives Approx. $25M from Tier-1 Manufacturer for High Bandwidth Memory (HBM)
03/29/2024 | CamtekCamtek Ltd. announced that it has received a new order for approximately $25 million from a tier-1 HBM manufacturer, for the inspection and metrology of High Bandwidth Memory (HBM). Most of the systems are expected to be delivered in the second half of 2024.
HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation
03/15/2024 | TrendForceTrendForce highlights the current landscape of the HBM market, which as of early 2024, is primarily focused on HBM3. NVIDIA’s upcoming B100 or H200 models will incorporate advanced HBM3e, signaling the next step in memory technology.