-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Todd Rountree Assumes the Role of CEO at Austin American Technology
February 19, 2024 | Austin American Technology (AAT)Estimated reading time: 1 minute
Austin American Technology (AAT) proudly announces the appointment of Todd Rountree as Chief Executive Officer (CEO). With nearly 8 years of dedicated service as President and COO, Rountree brings a wealth of experience and a proven track record of leadership to his new role.
During his tenure as President and COO, Rountree has been instrumental in driving the growth and success of Austin American Technology, as well as orchestrating the recent merger with Aqua Klean Systems. He has demonstrated exceptional leadership in overseeing all aspects of the business, including profit and loss management, cash flow management, sales, marketing, operations, and manufacturing. Rountree's strategic vision and hands-on approach have been pivotal in expanding AAT's market presence both nationally and internationally.
"I am honored to take on the role of CEO at Austin American Technology," said Todd Rountree. "Over the past eight years, I have had the privilege of working alongside a talented team dedicated to delivering cutting-edge cleaning solutions to our customers. I am excited to continue building on AAT's legacy of innovation as we strive to meet the evolving needs of the electronics manufacturing industry."
Under Rountree's leadership, Austin American Technology has solidified its position as an industry leader in modern cleaning technology. With a history spanning 37 years, AAT has established itself as a trusted provider of high-quality circuit board cleaning tools, including high-production inline cleaners, batch style cleaners, stencil cleaners, and solvent cleaners with ROSE testing capabilities. The company's advanced cleaning and drying technology, coupled with several patented systems, set AAT apart as a preferred choice for customers worldwide.
In his new role as CEO, Rountree will continue to oversee AAT's operations, including its facilities in Austin, TX, and Anaheim, CA. He will work closely with the executive team and the Board of Directors to drive innovation, expand market reach, and further enhance customer satisfaction.
Suggested Items
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.
BrainChip, Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
05/06/2024 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and Frontgrade Gaisler, a leading provider of space-grade system-on-chip solutions, announce their collaboration to explore the integration of BrainChip’s AkidaTM neuromorphic processor into Frontgrade Gaisler’s next generation fault-tolerant, radiation-hardened microprocessors.