I-Connect007 Editor’s Choice: Five Must-Reads for the Week
August 18, 2023 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
Summer is almost over; it seems like it just started. But I got in some much-needed beach time last week, so I’m happy. Have you taken any vacation time this summer?
The news and innovations in our industry haven’t really slowed down during the summer months, as evidenced by this week’s Top Five. This week, we have an article about flex-hybrid electronics, which the military and aerospace folks are following closely. We have an article about the digital twin and what it is—and what it’s not.
We have 10 outside-the-box ideas for closing the deal—be sure to forward this to your sales team. John Perry brings us an interview with a father/son team of IPC volunteers. (Would you want your children to work in this industry?) Finally, John Watson discusses AI, simulation and SPICE, and what they have to offer for PCB designers.
I’ll talk to you all soon!
Flexible Thinking: Growth of Flex and Flex-hybrid Electronics in Mil-Aero Applications
Published August 15
Technologists working with flexible circuits seem to come up with new, innovative ideas almost weekly. One of the latest is flex-hybrid electronics, which have shown plenty of promise in the mil-aero community. Joe Fjelstad explains what FHE could do for our industry, and the warfighter of the future as well.
Drilling Down on Digital Twin
Published August 16
In this interview, Phil Voglewede, director of the Omron Advanced Automation Lab at Marquette, breaks down the relationship between digital twin and automation. As he points out, it’s not just simulation. Ask not what you can do for digital twin; ask what digital twin can do for you!
It’s Only Common Sense: My 10 Favorite Creative Sales Tactics
Published August 14
It’s tough making a sale these days, and your sales team need every advantage. This week, Dan Beaulieu shares 10 of his favorite sales tactics that are a little off the beaten path, including nostalgia and “gamification.” Check it out.
From Father to Son: A Story of Generational Volunteerism
Published August 16
Would you want your children (or grandchildren) to get into this industry? IPC’s John Perry has a great interview with Scott Bowles and his son Steven, who both work for Lockheed Martin and serve as IPC volunteers. Do they talk about solder mask during Thanksgiving dinner?
Elementary, Mr. Watson: Circuit Simulation, SPICE, and AI
Published August 15
There’s been a lot of talk about AI lately. But what does it mean for our industry? In this column, John Watson explains how PCB designers and design engineers can benefit from utilizing AI, and how circuit simulation and SPICE are somewhat related to AI. Interesting stuff.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.